首页 > 《力学学报：英文版》 > 1997年2期 > STUDY OF FAILURE MODES OF MICROELECTRONIC PACKAGING MODULES BY HOLOGRAPHY QUASI PROJECTION MOIRE METHOD

STUDY OF FAILURE MODES OF MICROELECTRONIC PACKAGING MODULES BY HOLOGRAPHY QUASI PROJECTION MOIRE METHOD

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摘要 Inthispaper,anovelinterferometricmethodwithawiderangeofsensitivities,calledholographyquasiprojectionmoire,isproposed.Itcombinesthefeaturesofthevariateddoubleprojectionmoiremethodandtheholographicinterfer-ometrymethod.Thistechniqueisusedtostudythefailuremodesofmicroelectronicpackagingmodules.

DOI pj0x9988jy/1053403

作者史训清;刘宝琛;戴福隆

机构地区不详

出处《力学学报：英文版》 1997年2期

关键词 HOLOGRAPHY QUASI PROJECTION MOIRE sensitivity failure

分类 [理学][力学]

出版日期 1997年02月12日（中国期刊网平台首次上网日期，不代表论文的发表时间）

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来源期刊

力学学报：英文版

力学学报：英文版

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相关关键词

HOLOGRAPHY QUASI PROJECTION MOIRE sensitivity failure

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