摘要
Inthisstudy,atwo-stepheatingprocessisintroducedfortransientliquidphase(TLP)diffusionbondingforsoundjointswithT91heatresistantsteels.Atfirst,ashort-timehighertemperatureheatingstepisaddressedtomelttheinterlayer,followedbythesecondsteptocompleteisothermalsolidificationatalowtemperature.Themostcriticalfeatureofournewmethodisproducinganon-planarinterfaceattheT91heatresistantsteelsjoint.WeproposeatransitionalliquidphasebondingofT91heatresistantsteelsbythisapproach.Sincejointmicrostructureshavebeenstudied,wetestedthetensilestrengthtoassessjointmechanicalproperty.Theresultindicatesthatthesolidifiedbondmaycontainaprimarysolid-solution,similarcompositiontotheparentmetalandfreefromprecipitates.Jointtensilestrengthofthejointisnotlowerthanparentmaterials.Jointbend'sstrengthsareenhancedduetothehighermetal-to-metaljunctionproducinganon-planarbondlines.Nevertheless,thetraditionaltransientliquidphasediffusionbondingproducesplanarones.Bondingparametersofnewprocessare1260℃for0.5minand1230℃for4min.
出版日期
2017年02月12日（中国期刊网平台首次上网日期，不代表论文的发表时间）
