Laser machining of transparent brittle materials: from machining strategies to applications

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摘要 Transparentbrittlematerialssuchasglassandsapphirearewidelyconcernedandappliedinconsumerelectronics,optoelectronicdevices,etc.duetotheirexcellentphysicalandchemicalstabilityandgoodtransparency.Growingresearchattentionhasbeenpaidtodevelopingnovelmethodsforhigh-precisionandhigh-qualitymachiningoftransparentbrittlematerialsinthepastfewdecades.Amongthevarioustechniques,lasermachininghasbeenprovedtobeaneffectiveandflexiblewaytoprocessallkindsoftransparentbrittlematerials.Inthisreview,aseriesoflasermachiningmethods,e.g.laserfullcutting,laserscribing,laserstealthdicing,laserfilament,laserinducedbacksidedryetching(LIBDE),andlaserinducedbacksidewetetching(LIBWE)aresummarized.Additionally,applicationsofthesetechniquesinmicromachining,drillingandcutting,andpatterningareintroducedindetail.Currentchallengesandfutureprospectsinthisfieldarealsodiscussed.
机构地区 不详
出处 《光电进展(英文)》 2019年1期
出版日期 2019年01月11日(中国期刊网平台首次上网日期,不代表论文的发表时间)
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