Reactive DC Magnetron Sputter Deposited Titanium- Copper-Nitrogen Nano-Composite Thin Films with an Argon/Nitrogen Gas Mixture

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摘要 AsinteredTi_(13)Cu_(87)targetwassputteredbyreactivedirectcurrent(DC)magnetronsputteringwithagasmixtureofargon/nitrogenfordifferentsputteringpowers.Titanium-copper-nitrogenthinfilmsweredepositedonSi(111),glassslideandpotassiumbromide(KBr)substrates.Phaseanalysisandstructuralpropertiesoftitanium-copper-nitrogenthinfilmswerestudiedbyX-raydiffraction(XRD).ThechemicalbondingwascharacterizedbyFouriertransforminfrared(FTIR)spectroscopy.TheresultsfromXRDshowthattheobservedphasesarenano-crystallitecubicantirheniumoxide(antiReO_3)structuresoftitaniumdopedCu_3N(Ti:Cu_3N)andnanocrystallitefacecenteredcubic(fcc)structuresofcopper.ScanningelectronmicroscopyandenergydispersiveX-rayspectroscopy(SEM/EDX)wereusedtodeterminethefilmmorphologyandatomictitanium/copperratio,respectively.Thefilmspossesscontinuousandagglomeratedstructurewithanatomictitanium/copperratio(~0.07)belowthatoftheoriginaltarget(~0.15).Thetransmittancespectraofthecompositefilmsweremeasuredintherangeof360nmto1100nm.Filmthickness,refractiveindexandextinctioncoefficientwereextractedfromthemeasuredtransmittanceusingareverseengineeringmethod.Inthevisiblerange,thehigherabsorptioncoefficientofthefilmspreparedatlowersputteringpowerindicatesmorenitrificationincomparisontothosepreparedathighersputteringpower.ThisisconsistentwiththeformationoflargerTi:Cu_3Ncrystallitesatlowersputteringpower.Thedepositionratevs.sputteringpowershowsanabrupttransitionfrommetallicmodetopoisonedmode.Acomplicatedbehaviorofthefilms'resistivityuponsputteringpowerisshown.
机构地区 不详
出版日期 2010年06月16日(中国期刊网平台首次上网日期,不代表论文的发表时间)
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