简介:研究一系列Al-Si-Ge钎料用于铝钎焊,并对钎料合金的显微组织和性能进行分析。结果表明:Al-12Si共晶合金中添加从0到30%(质量分数)的Ge,可使Al-Si-Ge钎料合金的液相线温度由592℃下降到519℃。随着Ge含量的增加,形成了Al-Ge共晶组织。然而,当Ge含量超过20%时,共晶组织趋于聚集长大,钎料合金中形成粗大颗粒状的初生Si-Ge相,这些粗大组织的形成极大地降低了钎料合金的性能。Al-10.8Si-10Ge钎料具有优良的加工性能和铺展润湿性,当采用此钎料钎焊1060纯铝时,可以获得完整的钎焊接头,剪切测试结果表明此钎料钎焊接头的断裂位置发生在母材。
简介:AhotrunnermanifoldasaPvTapparatus,ApplicationofindustrialwasteofPET/PEcore/sheathnon-wovenfabricstocompositematerials,Automationandinnovativeprocesstechnologymouldsbirkby'sfuture,HDPEblow-moldedbottlepinch-offweldstrengthatvariousmolecularweights,Mercer'skernelbasedlearningforfaultdetection,Micromoulding:processcharacteristicsandproductproperties,Microstructureofblowmoldedbottlesfrompolyolefinnanocompositespreparedbymeltcompounding.
简介:NewBattenfeldRl0robotfirstpresentedatFAKUMA:thedynamicstarperformeroftheUNIROBseries;Polymerweldingofinjectionmoldedceramicsandmetals;Shopfloorschedulingwithsimulationbasedproactivedecisionsupport;Thepotatoasarawmaterialforbiodegradableplastics;Thresholdenergyswitchinganditsapplicationtowirelesssensinginhighenergymanufacturingprocesses;Tribologicalstudiesofpolyamide6andhigh-densitypolyethyleneblendsfilledwithPTFEandcopperoxideandreinforcedwithshortglassfibers。
简介:ThemicrostructureandtensilepropertiesofSn-9Znsolderunderdifferentcoolingandagingconditionwerestudied.Duringsolidification,thedistributionofZn-richphasesandgrainsizeinthemicrostructureofSn-9Znsolderweredecidedbythecoolingrate.TheZn-richphaseinSn-9Znsolderunderfurnacecooling,aircoolingandwatercoolingmediawasseparatelyexistedascoarsendendriticandneedlelikeshape,fineneedlelikeshapeandveryfinerod-likeshape,respectively.Afteraging,thecoarsendendriticwasbrokenandthecoarsenneedlelikeZn-richphasewaspartlychangedintofinedistributionofZn-richphaseforSn-9Znsolderwithfurnacecooling,andtherod-likeZnphaseintheSn-9ZnsolderunderwatercoolingwaschangedtoconglomeratedZnwithneedleshape.DuringtensiletestingonSn-9Znsolder,tensilestrengthandductilityreachedthebestwithwatercooling,butdecreasedwithagingeffect.Meanwhile,theductilityofsolderwithaircoolingandthestrengthofsolderwithfurnacecoolingincreasedwithaging.Thefracturemodewasductileandwasindependentofcoolingmediaandagingeffect.Thesizeanddepthofdimplesdecreasedfromwater,furnacetoaircooling.Afteraging,numberandsizeofdimplesincreasedonthesolderwithfurnacecoolingandaircooling.ThechangeonthesizeofdimplesfortheSn-9Znsolderunderdifferentcoolingconditionandwithagingeffectwasaccordancetothetensileproperties.