简介：PackagingofMEMS(micro-electro-mechanicalsystem)devicesposesmorechallengesthanconventionalICpackaging,sincetheperformanceoftheMEMSdevicesishighlydependentonpackagingprocesses.ALandGridArray(LGA)packageisintroducedforMEMStechnologybasedlinearmulti-axisaccelerometers.FiniteelementmodelingisconductedtosimulatethewarpagebehavioroftheLGApackages.Amethodtocorrelatethepackagewarpagetomatrixblockwarpagehasbeendeveloped.Warpageforbothpackageandsensorsubstrateareobtained.Warpagepredictedbysimulationcorrelatesverywellwithexperimentalmeasurements.Basedonthisvalidatedmethod,detaileddesignanalysiswithdifferentpackagegeometricalvariationsarecarriedouttooptimizethepackagedesign.Withtheoptimizedpackagestructure,thepackagingeffectonaccelerometersignalperformanceiswellcontrolled.