简介:EmployingLi2CO3,NiO,Co3O4,andMnCO3powdersasstartingmaterials,Li[Ni1/3Co1/3Mn1/3]O2wassynthesizedbysolid-statereactionmethod.Variousgrindingaidswereappliedduringmillinginordertooptimizethesynthesisprocess.Aftersuccessiveheattreatmentsat650and950℃,thepreparedpowderswerecharacterizedbyX-raydiffraction(XRD)analysis,scanningelectronmicroscopy,andtransmissionelectronmicroscopy.Thepowderspreparedbyaddingsalt(NaCl)asgrindingaidexhibitaclearR3mlayerstructure.ThepowdersbyothergrindingaidslikeheptaneshowsomeimpuritypeaksintheXRDpattern.Theformerpowdersshowauniformparticlesizedistributionoflessthan1μmaveragesizewhilethelattershowsawidedistributionrangingfrom1to10μm.EnergydispersiveX-ray(EDX)analysissshowthattheratioofNi,Co,andMncontentinthepowderisapproximately1/3,1/3,and1/3,respecively.TheEDXdataindicatenoincorporationofsodiumorchlorineintothepowders.Charge-dischargetestsgaveaninitialdischargecapacityof160mAh·g-1forthepowderswithNaCladditionwhile70mAh·g-1forthepowderswithheptane.
简介:Inthisinvestigation,themechanicalpropertiesandlow-temperaturefracturetoughnessofAPI5LX65offshorepipelineweldedjointswerestudied.StructureIntegrityAssessmentProcedure(SINTAP)-FailureAssessmentDiagram(FAD)methodwasappliedtothepipestructurewithsurfaceflawattheweldtoe.AccordingtotheISOstandardBS7448,theCTODfracturetoughnessoftheweldedjointswasdeterminedatthetemperatureof0℃.Fortheheat-affectedzone(HAZ)specimens,post-testmetallographicanalysiswasperformedtoverifythatthetipofthecrackwaslocatedinthecoarsecrystalzoneinordertoconfirmthevalidityoftheaboveresults.Thefailurelinesofanalysislevel1and3ofweldmetalwerederivedfromtheresultsofthemechanicalpropertytest.Theassessmentwasperformed,consideringthemaximumlaystress,residualstressconservativelyassumedtobeuniformtensilestress,andminimumCTODvalue.Theresultsoftheassessmentshowedthatpipelinestructurewithasurfaceflaw(theheightandlengtharerespectively2.2mmand5mm)attheweldtoeissafe.ThisstudylaysthefoundationofapplicationofSINTAPtopipelinestructureassessment.
简介:X-rayDouble-crystalDiffractometerwithHorizontalSlitsandItsApplicationsXuJingyangandZhuNanchang徐景阳,朱南昌(ShanghaiInstituleofMeta...
简介:本文中介绍了物联网的特点及其相关电子产品对PCB基板材料的要求、目前市场上可供选用基板材料的品种、规格及其主要性能等情况。
简介:通过一个简单的水热方法成功地合成出由SnO2纳米片作次级结构的新型花状ZnSnO3-SnO2分级纳米结构。ZnSnO3多面体在生长分级SnO2纳米片的过程中主要起模版作用,制备出的SnO2纳米片的厚度约为25nm。还讨论了ZnSnO3-SnO2样品的形貌随反应时间变化的规律,并且进一步讨论了形成这种分级结构的形成机制。此外,由这种新型ZnSnO3-SnO2纳米结构作敏感材料的气体传感器对乙醇气体具有高灵敏和快响应的特点。ZnSnO3-SnO2纳米片在最佳工作温度270°C时,对50×10-6乙醇气体的灵敏度约为27.8,其响应和恢复时间分别在1s和1.8s内。