Thethermalstressofthequartzoscillatormodulepackagingisinvestigatedusingdistal-im-agecorrelationmethod(DICM),andtheexperimentalresultsaregiven.Underthequartzoscillatormodulepackaging,thequartzoscillatorandtheFe-Sn-Cualloyframearejoinedtogetherwiththeelectroconductiveadhesive(PI),andtheelectroconductiveadhesiveneedstobecuredtwiceat150℃and275℃respective-ly.AsthequartzoscillatorandtheFe-Sn-Cualloyframehaveadistinctdifferenceinboththermalexpansioncoefficientsandmechanicalpropertiesandinprocessofpackagingtemperaturerisesordrops,thethermalstressisyieldedeasily.Whiletemperaluredrops,thenormalstressatthequartzoscillatoredgeisatensilestress,whichcanmakethequartzoscillatorfracture.
