Forthedevelopmentofalow-melting-pointfillermetalforbrazingaluminumalloys,aseriesofAl-Si-Cu-(Ni,Sn,Zn)fillermetalshavebeenstudied.Throughdifferentialthermalanalysis(DTA),themeltingtemperaturesofsuchAl-Si-Cu-(Ni,Sn,Zn)fillermetalsweredetermined.Theresultsshowthattheadditionof3wt.%-5wt.%SnintotheAl-6Si-15Cufillermetalcausesitssolidustemperaturetodecreasebyabout12℃.ThefillermetalwiththecompositionAl-6Si-l5Cu-2Niisproposed,whichpossessesameltingtemperaturerangeof512℃to520℃andamicrostructarethatincludesanAl-Cueutecticphases,Al-Si-Cueutecticphases,siliconparticlesandCu_2Al,AlNi_3,Al_7Cu_4NiandAl_3Ni_2intermetalliccompounds.Anadditionof5wt.%-7wt.%ZnintosuchAl-Si-Cufillermetalscausetheirsolidustemperaturestodropfurthertoavaluelowerthan498℃.MetallographicobservationsindicatethattheadditionofZnintotheAl-Si-CufillermetalinhibitstheformationoftheAl-Si,Al-CuandAl-Si-Cueutecticphases.TheremainingphasesareaAl_2Cuintermetalliecompound,anα-Alsolidsolutionandsiliconparticles.
