Measurement of Thermal Expansion Coefficients with Holographic Technique

(整期优先)网络出版时间:1995-01-11
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Asimplifiedmathematicalmodelwascreatedformeasurementofthermalexpansioncoefficientsofthinsheetmaterialswithholographictechnique.Experimentalset-upscorrespondingtothemathematicalmodelweredesignedandbuiltforbothtestsaboveroomtemperatureandatlowtemperatures.Afringecontroltechniquewasintroducedforlowtemperaturemeasurementstocompensaterigidbodymovement,THinsheetspecimensofsiliconandaluminumalloy(7075)weretestedwiththedevelopedtechnique.Thetestedresultsareingoodagreementwithreporteddataandthusverifythevalidityofthedevelopedtechnique.TheThermalexpansioncoefficientsofthetestedmaterialsrangedfrom2.5×10^-60C^-1to23.6×10^-6oC^-1.