简介：Insomesituations,theacceleratedlifetestonenvironmentalstressforelectronicproductsisnoteasilyimplementedduetovariousrestrictions,andthusengineersarelackingofdataoftheproductlifetest.Concerningthisproblem,environmentallifeoftheprintedcircuitboard(PCB)boardiscalculatedbywayofphysicsoffailure.InfluencesofthermalcycleandvibrationonPCBanditscomponentsarestudied.BasedontheanalysisofforceandstressbetweencomponentsandthePCBboardinthermalcycleeventsandvibrationevents,fourlifecomputingmodelsofpinsandsoldereddotsareestablished.Themillerdamageratioisusedtocalculatetheaccumulateddamageofapinorasoldereddot,andthentheenvironmentlifeofthePCBboardcanbedeterminedbythefirstfailedone.Finally,anexampleisusedtoillustratethemodelsandtheircalculations.