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2012年3期
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Low temperature soldering alloy using Sn63 Pb37 implantation of silica ceramics and copper solder assisted by ion and deposition
Low temperature soldering alloy using Sn63 Pb37 implantation of silica ceramics and copper solder assisted by ion and deposition
(整期优先)网络出版时间:2012-03-13
作者:
徐睦忠;田修波;巩春志;杨波;杨士勤
金属学及工艺
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中国焊接:英文版
2012年3期
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Low temperature soldering alloy using Sn63 Pb37 implantation of silica ceramics and copper solder assisted by ion and deposition
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