简介：ThisstudyintendstoinvestigatehowtheelasticityofabacterialphagecanafecttheprocessofDNApackagingandejection.Forthispurpose,weproposeaunifiedcontinuumandstatisticalmechanicsmodelbytakingintoaccounttheefectsofDNAbendingdeformation,electrostaticrepulsionbetweenDNA–DNAstrandsandelasticdeformationofthephagecapsid.Basedonsuchamodel,wederivethequantitativerelationsbetweenpackagingforce,elasticityofcapsid,DNAlengthremaininginthecapsid,osmoticpressureandejectiontime.Thetheoreticallypredictedresultsarefoundtoagreeverywellwithinvitroexperimentalobservationsintheliterature.

简介：Inthispaper,theout-of-planedeformationofsiliconsurfaceofDirectChipAttachment(DCA)assembly,underthermalloading,wasmeasuredinreal-timebyTwyman/Greeninterferometry.Thecontourmapsoftheout-of-planedisplacementfieldsofsiliconsurfaceunderthermalloadingandcyclingofvarioustemperaturewereobtained.Experimentalresultsshowthattherelationbetweentheout-of-planedisplacementandtemperatureisnonlinearandvarieswithtempera-turecycling,duetononlinearmechanicalbehaviorofthematerialsusedinelectronicpackaging.Acomparisonoftheout-of-planedisplacementfieldsofsiliconsurfacemeasuredbyT/Ginterferometryinreal-timeandreplicatingtechniqueofhightem-peraturespecimengratingofmoireinterferometrywasmade.

简介：Inthispaper,anovelinterferometricmethodwithawiderangeofsensitivities,calledholographyquasiprojectionmoire,isproposed.Itcombinesthefeaturesofthevariateddoubleprojectionmoiremethodandtheholographicinterfer-ometrymethod.Thistechniqueisusedtostudythefailuremodesofmicroelectronicpackagingmodules.