简介:Thethermalstressofthequartzoscillatormodulepackagingisinvestigatedusingdistal-im-agecorrelationmethod(DICM),andtheexperimentalresultsaregiven.Underthequartzoscillatormodulepackaging,thequartzoscillatorandtheFe-Sn-Cualloyframearejoinedtogetherwiththeelectroconductiveadhesive(PI),andtheelectroconductiveadhesiveneedstobecuredtwiceat150℃and275℃respective-ly.AsthequartzoscillatorandtheFe-Sn-Cualloyframehaveadistinctdifferenceinboththermalexpansioncoefficientsandmechanicalpropertiesandinprocessofpackagingtemperaturerisesordrops,thethermalstressisyieldedeasily.Whiletemperaluredrops,thenormalstressatthequartzoscillatoredgeisatensilestress,whichcanmakethequartzoscillatorfracture.
简介:ThisstudyintendstoinvestigatehowtheelasticityofabacterialphagecanafecttheprocessofDNApackagingandejection.Forthispurpose,weproposeaunifiedcontinuumandstatisticalmechanicsmodelbytakingintoaccounttheefectsofDNAbendingdeformation,electrostaticrepulsionbetweenDNA–DNAstrandsandelasticdeformationofthephagecapsid.Basedonsuchamodel,wederivethequantitativerelationsbetweenpackagingforce,elasticityofcapsid,DNAlengthremaininginthecapsid,osmoticpressureandejectiontime.Thetheoreticallypredictedresultsarefoundtoagreeverywellwithinvitroexperimentalobservationsintheliterature.
简介:Inthispaper,theout-of-planedeformationofsiliconsurfaceofDirectChipAttachment(DCA)assembly,underthermalloading,wasmeasuredinreal-timebyTwyman/Greeninterferometry.Thecontourmapsoftheout-of-planedisplacementfieldsofsiliconsurfaceunderthermalloadingandcyclingofvarioustemperaturewereobtained.Experimentalresultsshowthattherelationbetweentheout-of-planedisplacementandtemperatureisnonlinearandvarieswithtempera-turecycling,duetononlinearmechanicalbehaviorofthematerialsusedinelectronicpackaging.Acomparisonoftheout-of-planedisplacementfieldsofsiliconsurfacemeasuredbyT/Ginterferometryinreal-timeandreplicatingtechniqueofhightem-peraturespecimengratingofmoireinterferometrywasmade.
简介:Inordertoachievesustainableutilizationofnaturalresources,saveenergyandprotectenvironmentandecosystem,itisimportantforaregionoranationtodevelopandimplementaviablewasterecyclingmodelfromboththeoreticalandpracticalpointofview.Somepackagingrecyclingmodelsoperatedindevelopedcountriesareintroducedinthisarticle.Aluminiumcanrecoveryandrecyclingisemphasized.Costeffective,economicandenvironmentalbenefitofdifferentmodelsarecomparedandanalyzed.Theresultshowsthatallrecyclingmodelshavetheircharacteristicsduetotheinitialpurposeofrecoveryandthesituationoftheimplementingcountry.However,allthemodelscontributetothereductionofmunicipalsolidwastedisposalandresourcesconservation.
简介:Fatiguecrackingtestsofasolderjointwerecarriedoutusingin-situscanningelectronmicroscopy(SEM)technologyundertensileandbendingcyclicloadings.Themethodforpredictingthefatiguelifeisprovidedbasedonthefatiguecrackgrowthrateofthesolderjoint.Theresultsshowthattheeffectoftheloadingtypeonthefatiguecrackgrowthbehaviorofasolderjointcannotbeignored.Inaddition,thefiniteelementanalysisresultshelpquantitativelyestimatetheresponserelationshipbetweensolderjointstructures.Thefatiguecrackinitiationlifeofasolderjointisingoodagreementwiththefatiguelife(N50%)ofatotallyelectronicboardwith36solderjoints.
简介:Inthispaper,anovelinterferometricmethodwithawiderangeofsensitivities,calledholographyquasiprojectionmoire,isproposed.Itcombinesthefeaturesofthevariateddoubleprojectionmoiremethodandtheholographicinterfer-ometrymethod.Thistechniqueisusedtostudythefailuremodesofmicroelectronicpackagingmodules.
简介:Diamond/Cu-xCrcomposites被压力渗入过程制作。diamond/Cu-xCr的热传导性(x=0.1,0.5,0.8)composites在650W/mK上面,比diamond/Cucomposites的高。张力的力量从186~225MPa,并且结合的力量从400~525MPa。thermo物理的性质和接口结构上的Cr元素的影响被分析。当Cr3C2和Cr3C2的数量随Cu-xCr合金的Cr集中的增加增加了,中间的层被证实。当Cr集中直到0.5wt.%时,Cr3C2层的内容是不变的。当Cr3C2层的厚度变得更大,composites显示出更低的热传导性但是更高机械的性质。diamond/Cu-xCr的热扩大(CTE)的系数(x=0.1,0.5,0.8)composites在对Kerner模型的预言的好同意。