简介:Thethermalstressofthequartzoscillatormodulepackagingisinvestigatedusingdistal-im-agecorrelationmethod(DICM),andtheexperimentalresultsaregiven.Underthequartzoscillatormodulepackaging,thequartzoscillatorandtheFe-Sn-Cualloyframearejoinedtogetherwiththeelectroconductiveadhesive(PI),andtheelectroconductiveadhesiveneedstobecuredtwiceat150℃and275℃respective-ly.AsthequartzoscillatorandtheFe-Sn-Cualloyframehaveadistinctdifferenceinboththermalexpansioncoefficientsandmechanicalpropertiesandinprocessofpackagingtemperaturerisesordrops,thethermalstressisyieldedeasily.Whiletemperaluredrops,thenormalstressatthequartzoscillatoredgeisatensilestress,whichcanmakethequartzoscillatorfracture.
简介:Inthispaper,theout-of-planedeformationofsiliconsurfaceofDirectChipAttachment(DCA)assembly,underthermalloading,wasmeasuredinreal-timebyTwyman/Greeninterferometry.Thecontourmapsoftheout-of-planedisplacementfieldsofsiliconsurfaceunderthermalloadingandcyclingofvarioustemperaturewereobtained.Experimentalresultsshowthattherelationbetweentheout-of-planedisplacementandtemperatureisnonlinearandvarieswithtempera-turecycling,duetononlinearmechanicalbehaviorofthematerialsusedinelectronicpackaging.Acomparisonoftheout-of-planedisplacementfieldsofsiliconsurfacemeasuredbyT/Ginterferometryinreal-timeandreplicatingtechniqueofhightem-peraturespecimengratingofmoireinterferometrywasmade.
简介:Inordertoachievesustainableutilizationofnaturalresources,saveenergyandprotectenvironmentandecosystem,itisimportantforaregionoranationtodevelopandimplementaviablewasterecyclingmodelfromboththeoreticalandpracticalpointofview.Somepackagingrecyclingmodelsoperatedindevelopedcountriesareintroducedinthisarticle.Aluminiumcanrecoveryandrecyclingisemphasized.Costeffective,economicandenvironmentalbenefitofdifferentmodelsarecomparedandanalyzed.Theresultshowsthatallrecyclingmodelshavetheircharacteristicsduetotheinitialpurposeofrecoveryandthesituationoftheimplementingcountry.However,allthemodelscontributetothereductionofmunicipalsolidwastedisposalandresourcesconservation.
简介:Inthispaper,anovelinterferometricmethodwithawiderangeofsensitivities,calledholographyquasiprojectionmoire,isproposed.Itcombinesthefeaturesofthevariateddoubleprojectionmoiremethodandtheholographicinterfer-ometrymethod.Thistechniqueisusedtostudythefailuremodesofmicroelectronicpackagingmodules.